华虹公司:港股公告:截至二零二四年十二月三十一日止年度全年业绩公告

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份內容而產生或因倚 賴該等內容而引致的任何損失承擔任何責任。
HUA HONG SEMICONDUCTOR LIMITED
華虹半導體有限公司
（於香港註冊成立之有限公司）
（股份代號：01347）
截至二零二四年十二月三十一日止年度全年業績公告
華虹半導體有限公司（「本公司」）董事會（「董事會」）謹此公佈本公司及其子公司 截至二零二四年十二月三十一日止年度的經審核業績。
本公告載列本公司二零二四年年度報告全文，並符合香港聯合交易所有限公司（「香港聯交所」）證券上市規則有關全年業績初步公告附載資料之相關規定。
本公司二零二四年年度報告的印刷版本將於適當時候寄發予本公司股東，並可於 香港聯交所網站www.hkexnews.hk及本公司網站www.huahonggrace.com進行查 閱。
承董事會命
華虹半導體有限公司
董事會主席兼執行董事
唐均君先生
中國上海，二零二五年三月二十七日
於本公告日期，本公司董事分別為：
執行董事：
唐均君（董事會主席）
白鵬（總裁）
非執行董事：
葉峻
孫國棟
陳博
熊承艷
獨立非執行董事：
張祖同
王桂壎太平紳士
封松林
CONTENTS
Definitions 2
Key Financials 6
Letter to Shareholders 7
Corporate Information 9
Directors and Senior Management Team 12
Corporate Governance Report 22
Directors’ Report 34
2024 Environmental, Social and Governance Report 66
Independent Auditor’s Report 293
Consolidated Statement of Profit or Loss 302
Consolidated Statement of Comprehensive Income 303
Consolidated Statement of Financial Position 304
Consolidated Statement of Changes in Equity 306
Consolidated Statement of Cash Flows 308
Notes to Financial Statements 310
Five Year Financial Summary 412

2 HUA HONG SEMICONDUCTOR LIMITED ● 2024 ANNUAL REPORT
DEFINITIONS
In this annual report, unless otherwise required by the context, the following terms shall have the meanings set out
below.
“Annual General Meeting” or an annual general meeting of the Company to be held on 8 May 2025;
“AGM”
“Articles” the articles of association of the Company (as amended from time to time);
“Board” the Board of Directors of the Company;
“China IC Fund” China Integrated Circuit Industry Investment Fund Co., Ltd.* (國家集成電路產業投
資基金股份有限公司), a company incorporated in the PRC on 26 September 2014;
its shareholders include the Ministry of Finance, the enterprises in the Integrated
Circuit Industry Cluster, large-scale state-owned enterprises, certain financial
institutions and private enterprises. It mainly focuses on the manufacturing of
semiconductor wafers and takes into account the upstream and downstream links
covering chip design, package test, equipment and materials etc;
“China IC Fund II” China Integrated Circuit Industry Investment Fund (Phase II) Co., Ltd.* (國家集成
電路產業投資基金二期股份有限公司), a company established in the PRC on 22
October 2019; its shareholders include the Ministry of Finance, the enterprises in
the Integrated Circuit Industry Cluster, large-scale state-owned enterprises, certain
financial institutions and private enterprises. It mainly invests in the value chain of
the integrated circuit industry via equity investment, primarily in integrated circuit
chip manufacturing as well as chip designing, packaging test and equipment
and materials. To the best of the Directors’ knowledge, information and belief and
having made all reasonable enquiry, China IC Fund II is not an associate of China
IC Fund under Chapter 14A of the Listing Rules;
“Company” or Hua Hong Semiconductor Limited, a company incorporated in Hong Kong with
“Hua Hong Semiconductor” limited liability on 21 January 2005 and, except where otherwise required by the
context, all of its subsidiaries, or its present subsidiaries where the context refers to
the time before it became the holding company of its present subsidiaries;
“Director(s)” the Director(s) of the Company;

2024 ANNUAL REPORT ● HUA HONG SEMICONDUCTOR LIMITED 3
DEFINITIONS
“EPS”